Socket and method for compensating for differing coefficients of thermal expansion
US7632127B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2008 |
| Grant date | Dec 15, 2009 |
| Priority date | — |
| Expiry date | Apr 10, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53265
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises at least two members that are coupled together and disposed to form an aperture in between the at least two members, wherein the surface mounted contacts extend from the aperture, and wherein at least one dimension of the at least two members is selected to compensate for a difference between the coefficients of thermal expansion between the socket and a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.