Method of preventing pinhole defects through co-polymerization
US7632631B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2005 |
| Grant date | Dec 15, 2009 |
| Priority date | — |
| Expiry date | Sep 8, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/136
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method is provided for forming a stable thin film on a substrate. The method includes depositing a co-polymer composition having a first component and a second component onto a substrate to form a stable film having a first thickness. The first component has first dielectric properties not enabling the first component by itself to produce the stable film having the first thickness. However, the second component has second dielectric properties which impart stability to the film at the first thickness. In a preferred embodiment, the second component includes a leaving group, and the method further includes first thermal processing the film to cause a solvent but not the leaving group to be removed from the film, after which second thermal processing is performed to at least substantially remove the leaving group from the film. As a result, the film is reduced to a second thickness smaller than the first thickness, and the film remains stable during both the first and the second thermal processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.