Method for soldering electronic component and soldering structure of electronic component
US7632710B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2006 |
| Grant date | Dec 15, 2009 |
| Priority date | — |
| Expiry date | Dec 12, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12049
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powder 8 is mixed into flux employed so as to intervene between a bump and an electrode. The metallic powder 8 has a flake or dendrite shape including a core segment 8a of the metal molten at a higher temperature than the liquid phase temperature of solder constituting a solder bump and a surface segment 8b of the metal with good-wettability for the molten solder and to be solid-solved in the core segment 8a molten. In the heating by the re-flow, the metallic powder remaining in the flux without being taken in a solder portion is molten and solidified to become substantially spherical metallic particles 18. Thus, after the re-flow, the metallic powder does not remain in a flux residue in a state where migration is likely to occur, thereby combining both solder connectivity and insurance of insulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.