Patent · US Active

Plastic overmolded packages with mechancially decoupled lid attach attachment

US7632717B2 · kind B2 · utility

1Cited by
4References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 15, 2008
Grant dateDec 15, 2009
Priority date—
Expiry dateAug 15, 2028

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/1815
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The specification describes a lidded MCM IC plastic overmolded package with a chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.