Encapsulation and methods thereof
US7633154B2 · kind B2 · utility
49Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2006 |
| Grant date | Dec 15, 2009 |
| Priority date | — |
| Expiry date | Jan 24, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8584
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention discloses an encapsulation comprising a metal substrate, a PCB on the metal substrate, a thermo-electric element in and/or on the PCB, and an LED on the thermo-electric element. Encapsulating methods are also provided by the invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.