Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel
US7633752B2 · kind B2 · utility
8Cited by
30References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 29, 2004 |
| Grant date | Dec 15, 2009 |
| Priority date | — |
| Expiry date | Dec 16, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The apparatus also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The apparatus further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.