Prediction of uniformity of a wafer
US7634325B2 · kind B2 · utility
8Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2007 |
| Grant date | Dec 15, 2009 |
| Priority date | — |
| Expiry date | Jul 30, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of monitoring uniformity of a wafer is provided. A wafer parameter is selected. Manufacturing data is collected. The manufacturing data includes measurements of the selected wafer parameter. An average offset profile of the wafer parameter for a first and second wafer is determined using the manufacturing data. The first and second wafer are associated with a product type and were processed by a processing tool. An offset profile for a third wafer is predicted for a wafer using the average offset profile. The third wafer is associated with the product type and was processed by the processing tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.