Patent · US Active

Chip carrier and system including a chip carrier and semiconductor chips

US7635911B2 · kind B2 · utility

0Cited by

3References

24Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Albert Auburger · Regenstauf, DE
Jochen Dangelmaier · Beratzhausen, DE
Volker Geungerich · Regensburg, DE
Bernd Stadler · Donaustauf, DE

Key dates

Filing date	Feb 22, 2006
Grant date	Dec 22, 2009
Priority date	—
Expiry date	Mar 15, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A chip carrier includes a first surface and a second surface that opposes the first surface. The chip carrier acts as a heat sink for semiconductor chips arranged on it. A first recess is provided in the first surface, and a second recess is provided in the second surface. First and second semiconductor chips are respectively received in the first and second recesses.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.