Method of retaining a substrate to a wafer chuck
US7636999B2 · kind B2 · utility
33Cited by
120References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2005 |
| Grant date | Dec 29, 2009 |
| Priority date | — |
| Expiry date | Oct 20, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49998
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of retaining a substrate to a wafer chuck. The method features accelerating a portion of the substrate toward the wafer chuck, generating a velocity of travel of the substrate toward the wafer chuck, and reducing the velocity before the substrate reaches the wafer chuck. In this manner, the force of impact of the portion with the wafer chuck is greatly reduced, which is believed to reduce the probability that the structural integrity of the substrate, and layers on the substrate and/or the wafer chuck, are damaged.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.