Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish
US7638564B2 · kind B2 · utility
2Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2006 |
| Grant date | Dec 29, 2009 |
| Priority date | — |
| Expiry date | Jun 4, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/259
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is provided a varnish of a low dielectric loss tangent resin composition which is low in viscosity and excellent in storage stability. The varnish of a low dielectric loss tangent resin composition contains a thermosetting monomer (A) having a weight average molecular weight of not more than 1,000, a high polymer (B) having a weight average molecular weight of not less than 5,000, a halogen flame-retardant agent (C), a silicon dioxide filler (D), and an organic solvent (E). The average particle diameter of each the components (C) and (D) is in the range of 0.2 to 3 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.