Method of manufacturing circuits
US7642126B2 · kind B2 · utility
1Cited by
17References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2002 |
| Grant date | Jan 5, 2010 |
| Priority date | — |
| Expiry date | May 26, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/095
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The method uses a laser beam directed through the substrate to the conductive area of the substrate in order to bond the two together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.