Semiconductor sensor for measuring a physical quantity and method of manufacturing the same
US7644623B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2008 |
| Grant date | Jan 12, 2010 |
| Priority date | — |
| Expiry date | Jan 29, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49103
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor pressure sensing apparatus includes a metallic stem having a diaphragm and a semiconductor sensor bonded to the diaphragm. The semiconductor sensor includes a gauge section and first and second bonding pads. The gauge section is configured to be deformed according to a deformation of the diaphragm. The first and second bonding pads are respectively connected to different positions of the gauge section so that an electrical resistance between the first and second bonding pads can change with a change in the deformation of the diaphragm. The gauge section is formed to a semiconductor layer of an silicon-on-insulator substrate. The semiconductor sensor is directly bonded to the diaphragm by activating contact surfaces between the semiconductor sensor and the diaphragm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.