Bond pads and methods for fabricating the same
US7646097B2 · kind B2 · utility
5Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2005 |
| Grant date | Jan 12, 2010 |
| Priority date | — |
| Expiry date | May 22, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Bond pads for semiconductor devices and method for fabricating the same are provided. A bond pad has a first passivation layer having a plurality of openings. A conductive layer which overlies the openings and portions of the first passivation layer, having a first portion overlying the first passivation layer and a second portion overlying the openings. A second passivation layer overlies the first passivation layer and covers edges of the conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.