Inventor · Hsinchu, TW

Shwang-Ming Jeng

38Patents
7h-index
50Co-inventors
72Inventor score

Filing activity: Jul 12, 2000 → Apr 18, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US6319809A Method to reduce via poison in low-k Cu dual damascene by UV-treatment Electricity 48 Expired
US6372661B1 Method to improve the crack resistance of CVD low-k dielectric constant material Emerging Cross-Sectional Technologies 32 Expired
US6846756B2 Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers Electricity 19 Expired
US6821905B2 Method for avoiding carbon and nitrogen contamination of a dielectric insulating layer Electricity 16 Expired
US6657284B1 Graded dielectric layer and method for fabrication thereof Electricity 12 Expired
US6753260B1 Composite etching stop in semiconductor process integration Electricity 11 Expired
US7626245B2 Extreme low-k dielectric film scheme for advanced interconnect Electricity 7 Active
US7365026B2 CxHy sacrificial layer for cu/low-k interconnects Electricity 6 Expired
US7723226B2 Interconnects containing bilayer porous low-k dielectrics using different porogen to structure former ratio Electricity 6 Active
US10510580B2 Dummy fin structures and methods of forming same Electricity 5 Active
US7646097B2 Bond pads and methods for fabricating the same Electricity 5 Expired
US7805692B2 Method for local hot spot fixing Physics 5 Active
USRE42514E1 Extreme low-K dielectric film scheme for advanced interconnects General 2 Active
US6620745B2 Method for forming a blocking layer Electricity 2 Expired
US7465676B2 Method for forming dielectric film to improve adhesion of low-k film Electricity 2 Active
US8993435B2 Low-k Cu barriers in damascene interconnect structures Electricity 2 Active
US11664268B2 Dummy fin structures and methods of forming same Electricity 1 Active
US8105947B2 Post etch dielectric film re-capping layer Electricity 1 Active
US7485949B2 Semiconductor device Electricity 1 Active
US8481412B2 Method of and apparatus for active energy assist baking Electricity 1 Active
US8673783B2 Metal conductor chemical mechanical polish Electricity 1 Active
US11069558B2 Dummy fin structures and methods of forming same Electricity 1 Active
US9589856B2 Automatically adjusting baking process for low-k dielectric material Electricity 1 Active
US9368452B2 Metal conductor chemical mechanical polish Electricity 0 Active
US10144109B2 Polisher, polishing tool, and polishing method Performing Operations; Transporting 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.