Light emitting diode package including monitoring photodiode
US7649208B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2005 |
| Grant date | Jan 19, 2010 |
| Priority date | — |
| Expiry date | Oct 9, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an LED package including photo diode. The LED package includes a silicon substrate, and a photo diode is formed in an upper part thereof. Also, an insulation layer is formed on the silicon substrate excluding at least a light-receiving area of the photodiode. In the LED package, an LED terminal is formed on the insulation layer to be connected to the photo diode. First and second LED connecting pads are formed on the insulation layer, and arranged on both sides of the photo diode. In addition, an LED chip is mounted on the silicon substrate, and connected to the first and second LED connecting pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.