Wiring substrate, semiconductor device, and method of manufacturing the same
US7649749B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 9, 2007 |
| Grant date | Jan 19, 2010 |
| Priority date | — |
| Expiry date | Jul 27, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09781
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring substrate includes a base insulating film, a first interconnection formed on a top surface side of the base insulating film, a via conductor provided in a via formed in the base insulating film, and a second interconnection provided on a bottom surface side of the base insulating film. The second interconnection is connected to the first interconnection via the via. The wiring substrate includes divided-substrate-unit regions, in each of which the first interconnection, the via, and the second interconnection are formed. The wiring substrate includes a warpage-controlling pattern on the base insulating film, with a warped shape such that when the wiring substrate rests on a horizontal plate, at least a central part of a plane surface of the substrate contacts the horizontal plate, with both ends of the side raised.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.