In-chip structures and methods for removing heat from integrated circuits
US7656027B2 · kind B2 · utility
24Cited by
29References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 2006 |
| Grant date | Feb 2, 2010 |
| Priority date | — |
| Expiry date | Sep 2, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An in-chip system and method for removing heat from integrated circuits is disclosed. One embodiment is a substrate with a front side and a back side. The front side of the substrate is capable of having formed thereon a plurality of transistors. A plurality of structures within the substrate contain a solid heat conductive media comprising carbon nanotubes and/or a metal, such as copper. At least some of the plurality of structures extend from the back side of the substrate into the substrate. In some embodiments, the carbon nanotubes are formed within the substrate using a catalyst.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.