Semiconductor device
US7656030B2 · kind B2 · utility
16Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2007 |
| Grant date | Feb 2, 2010 |
| Priority date | — |
| Expiry date | Apr 2, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Heating elements different in heat generating timing are laminated in a stacked state, and the heating element close to a wiring substrate is allowed to function as a heat diffusion plate for another heating element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.