Three dimensional microstructures and methods for making three dimensional microstructures
US7658831B2 · kind B2 · utility
35Cited by
3References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2005 |
| Grant date | Feb 9, 2010 |
| Priority date | — |
| Expiry date | Dec 28, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/1275
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support structure. A structure material can be electrodeposited onto the seed layer to create a three-dimensional structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.