Patent · US Active

Microshells for multi-level vacuum cavities

US7659150B1 · kind B1 · utility

57Cited by

31References

18Claims

0Family size

Assignee

Silicon Clocks, Inc. · US

Inventors

Pezhman Monadgemi · Fremont, US
Roger T. Howe · Lafayette, US
Emmanuel P. Quevy · Corona, US

Key dates

Filing date	Mar 9, 2007
Grant date	Feb 9, 2010
Priority date	—
Expiry date	Aug 8, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Microshells for encapsulation of devices such as MEMS and microelectronics. In an embodiment, the microshells include a planar perforated pre-sealing layer, below which a non-planar sacrificial layer is accessed, and a sealing layer to close the perforation in the pre-sealing layer after the sacrificial material is removed. The sealing layer may include a nonhermetic layer to physically occlude the perforation and a hermetic layer over the nonhermetic occluding layer to seal the perforation as a function of the dimension of the perforation to form cavities having different vacuum levels on the same substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.