Conductive structures for electrically conductive pads of circuit board and fabrication method thereof
US7659193B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2006 |
| Grant date | Feb 9, 2010 |
| Priority date | — |
| Expiry date | Dec 29, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Conductive structures for electrically conductive pads of a circuit board and fabrication method thereof are proposed. The fabrication method includes: providing a circuit board with a plurality of first, second and third electrically conductive pads; forming first and second conductive layers on the circuit board; forming first and second resist layers respectively on the first and second conductive layers, the resist layers having a plurality of openings for exposing the conductive layers on the pads; forming a metal layer in the openings of the first and second resist layers; and forming a first connecting layer on the metal layer; forming third and fourth resist layers on the first and second resist layers respectively, the third resist layer having a plurality of openings for exposing the first connecting layer on the metal layer on the second electrically.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.