Patent · US Active

Thermal interface material and solder preforms

US7663242B2 · kind B2 · utility

17Cited by

41References

40Claims

0Family size

Inventors

Brian G. Lewis · Branford, US
Bawa Singh · Cherry Hill, US
John P. Laughlin · Tucson, US
David Kyaw · Hollidaysburg, US
Anthony E. Ingham · Chiswick, GB
Attiganal Narayanaswamy Sreeram · Plainsboro, US
Leszek Hozer · Boston, US
Michael Liberatore · Trenton, US
Gerard R. Minogue · Kinnelon, US

Key dates

Filing date	Mar 6, 2007
Grant date	Feb 16, 2010
Priority date	—
Expiry date	May 20, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.