John P. Laughlin
5Patents
4h-index
10Co-inventors
46Inventor score
Filing activity: Nov 25, 2003 → Feb 25, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7187083B2 | Thermal interface material and solder preforms | Electricity | 17 | Expired |
| US7663242B2 | Thermal interface material and solder preforms | Electricity | 17 | Active |
| US9221131B2 | Solder alloy | Chemistry; Metallurgy | 4 | Active |
| US8191757B2 | Reducing joint embrittlement in lead-free soldering processes | Emerging Cross-Sectional Technologies | 4 | Active |
| US8641964B2 | Solder alloy | Chemistry; Metallurgy | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.