Electrostatic chuck
US7663860B2 · kind B2 · utility
7Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2004 |
| Grant date | Feb 16, 2010 |
| Priority date | — |
| Expiry date | Nov 23, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck for attracting and holding a substrate by using an electrostatic force includes a plurality of protrusion portions to be brought into contact with the substrate. The protrusion portions are formed of a ceramic dielectric including grains each having a specified particle diameter, and contact surfaces of the protrusion portions with the substrate are formed to have a surface roughness depending on the particle diameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.