Die detachment apparatus comprising pre-peeling structure
US7665204B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2006 |
| Grant date | Feb 23, 2010 |
| Priority date | — |
| Expiry date | Nov 8, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1179
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method are provided for detaching a die from an adhesive film, the apparatus comprising a vacuum platform having a surface configured to support a part of the adhesive film on which the die is attached. A plurality of pre-peeling columns having substantially flat contact surfaces are projectable relative to the surface of the vacuum platform to push against the adhesive film at the position of the die to generate initial peeling between the die and the adhesive film. Thereafter, a plurality of ejector pins that are positionable relative to the pre-peeling columns are operative to push against the adhesive film at the position of the die to generate further peeling between the die and the adhesive film. The die is then removed from the adhesive film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.