Method and apparatus for measuring shape of heat treatment jig
US7665367B2 · kind B2 · utility
0Cited by
7References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 28, 2008 |
| Grant date | Feb 23, 2010 |
| Priority date | — |
| Expiry date | Aug 3, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67309
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for measuring the shape of a heating treatment jig to be held by a holding portion of a vertical heat treatment apparatus includes measuring the shape of the heat treatment jig in a state that the position of a supporting portion for supporting the heat treatment jig is set to be the same as the position of the holding portion for the heat treatment jig in the vertical heat treatment apparatus. The heat treatment jig can be used for placing a semiconductor wafer to be subjected to heat treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.