Electronic devices including metallurgy structures for wire and solder bonding
US7665652B2 · kind B2 · utility
3Cited by
19References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2004 |
| Grant date | Feb 23, 2010 |
| Priority date | — |
| Expiry date | Oct 27, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Metallurgy structures for input/output pads of an electronic devices can be adapted to receive both solder and wire bonds. First and second metallurgy structures, for example, can be provided on respective first and second input/output pads of an electronic device such that the first and second common metallurgy structures have a shared structure adapted to receive both solder and wire bonds. A solder bond can thus be applied to the first metallurgy structure, and a wire bond can be applied to the second metallurgy structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.