Polyimide substrate and method of manufacturing printed wiring board using the same
US7666471B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Mar 22, 2006 |
| Grant date | Feb 23, 2010 |
| Priority date | — |
| Expiry date | Nov 3, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/097
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention is directed to an improved method for metallizing polymer substrates, such as polyimides. The present invention comprises the steps of surface treating the polymer substrate with a plasma jet or corona discharge surface treatment, conditioning and etching the polymer substrate with an etching solution comprising a hydroxide and ionic palladium, activating the polymer substrate with ionic palladium, reducing the palladium on the polymer substrate, plating an electroless nickel layer onto the prepared polymer substrate, and plating an electroless copper layer over the electroless nickel layer. The process of the invention provides an improved method for preparing the polymer substrate for subsequent electrolytic plating thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.