Micromechanical component and method for manufacturing such a component
US7667282B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2005 |
| Grant date | Feb 23, 2010 |
| Priority date | — |
| Expiry date | Jan 6, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/0127
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method and a micromechanical component which counteract manufacturing-process-related mechanical stresses in the membrane are provided. The membrane is formed on a substrate in a layer system and spans a cavity in the substrate. The layer system includes at least one base layer formed on the substrate for circuit elements. At least one structured masking layer is also formed on the base layer for defining the circuit elements. The masking layer is structured in the area of the membrane in such a way that mechanical stresses acting in the area of the membrane under vacuum are at least partially compensated, the intrinsic stress of the masking layer being taken into account in the layout of the structuring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.