Apparatus and method for preventing copper peeling in ECP
US7667835B2 · kind B2 · utility
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11References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2006 |
| Grant date | Feb 23, 2010 |
| Priority date | — |
| Expiry date | Aug 7, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/8411
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and method for preventing the peeling of electroplated metal from a wafer, is disclosed. The apparatus includes a seed layer detector system having a light source and a reflectivity detector. According to the method, the light source emits a beam of light onto a wafer and the reflectivity detector receives the light reflected from the wafer. The reflectivity of the wafer surface is measured to determine the presence or absence of a seed layer on the wafer, as well as whether the seed layer has a minimum thickness for optimum electroplating of a metal onto the seed layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.