Steven Lin
9Patents
4h-index
21Co-inventors
46Inventor score
Filing activity: Oct 16, 2003 → Aug 28, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7030016B2 | Post ECP multi-step anneal/H2 treatment to reduce film impurity | Electricity | 9 | Expired |
| US7432192B2 | Post ECP multi-step anneal/H2 treatment to reduce film impurity | Electricity | 7 | Active |
| US7208404B2 | Method to reduce Rs pattern dependence effect | Electricity | 5 | Expired |
| US7256120B2 | Method to eliminate plating copper defect | Electricity | 5 | Expired |
| US7253093B2 | Method for fabricating interconnection in an insulating layer on a wafer | Electricity | 1 | Expired |
| US7481910B2 | Method and apparatus for stabilizing plating film impurities | Chemistry; Metallurgy | 1 | Expired |
| US7122471B2 | Method for preventing voids in metal interconnects | Electricity | 0 | Expired |
| US7262067B2 | Method for conductive film quality evaluation | Electricity | 0 | Expired |
| US7667835B2 | Apparatus and method for preventing copper peeling in ECP | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.