Pattern evaluation method, method of manufacturing semiconductor, program and pattern evaluation apparatus
US7668373B2 · kind B2 · utility
6Cited by
6References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 29, 2005 |
| Grant date | Feb 23, 2010 |
| Priority date | — |
| Expiry date | Sep 13, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V10/471
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A pattern evaluation method includes: acquiring an image of a pattern to be evaluated, detecting edge points of the pattern from the image, creating a parameter curve having the detected edge points as control points thereof, and evaluating the pattern based on the created parameter curve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.