Patent · US Active

Method of measuring alignment of measurement pattern

US7670922B2 · kind B2 · utility

0Cited by
2References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 6, 2006
Grant dateMar 2, 2010
Priority date
Expiry dateMay 24, 2028

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A resist pattern for alignment measurement being shrunk by a heat flow includes a plurality of positive type or negative type line patterns. Widths of spaces between the line patterns are greater than twice those of the line patterns. Alternatively, the resist pattern comprises a box-shaped or slit-shaped measurement pattern and a pair of box-shaped or slit-shaped auxiliary patterns provided inside and outside the measurement pattern, respectively.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.