Grid array connection device and method
US7670951B2 · kind B2 · utility
5Cited by
1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2005 |
| Grant date | Mar 2, 2010 |
| Priority date | — |
| Expiry date | Sep 27, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/35
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.