Enhanced mechanical strength via contacts
US7671470B2 · kind B2 · utility
4Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2008 |
| Grant date | Mar 2, 2010 |
| Priority date | — |
| Expiry date | Jul 24, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides an enhanced interconnect structure with improved reliability. The inventive interconnect structure has enhanced mechanical strength of via contacts provided by embedded metal liners. The embedded metal liners may be continuous or discontinuous. Discontinuous embedded metal liners are provided by a discontinuous interface at the bottom of the via located within the interlayer dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.