Low height vertical sensor packaging
US7671478B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2005 |
| Grant date | Mar 2, 2010 |
| Priority date | — |
| Expiry date | Sep 7, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and method for packaging a magnetic sensor is described. A sensor die is constructed such that connection pads are situated on two opposing sides of the die in two vertical arrays. Bonding wires connect the connection pads on the sensor die to wire bond pads on a substrate. Alternatively, the connection pads are connected to solderable chip pads on the substrate using flip chip bonding. Traces and vias are used to connect the wire bond pads or the solderable chip pads to sensor package pads. The sensor package pads are located on a single side of a sensor package for mounting on a next assembly. The next assembly has a land pattern that includes at least one leveling pad for positioning the sensor die perpendicular to the next assembly while being mounted and a single row of pads for making connections to the sensor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.