Microelectromechanical devices and fabrication methods
US7671515B2 · kind B2 · utility
8Cited by
0References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2006 |
| Grant date | Mar 2, 2010 |
| Priority date | — |
| Expiry date | Jun 18, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes location of a piezoelectric material as part of a semiconductor sensing structure. The semiconductor sensing structure, in conjunction with the piezoelectric material, can be used as a sensing device to provide an output signal associated with a sensed event.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.