Cleaning device for chemical mechanical polishing equipment
US7674156B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2007 |
| Grant date | Mar 9, 2010 |
| Priority date | — |
| Expiry date | Oct 13, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B55/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A cleaning device for chemical-mechanical equipment, which includes: an irrotatable center shaft irrotatably coupled with a spindle which is rotated, the irrotatable center shaft including a first channel and a second channel formed in an interior of the irrotatable center shaft, cleaning liquid flowing into the first channel and compressed gas flowing into the second channel; and a nozzle block coupled with the spindle so as to revolve about the irrotatable center shaft above a polishing pad, the nozzle block mixing cleaning liquid supplied through the first channel with compressed gas supplied through the second channel so as to generate twin-fluid, and pressure-injecting the mixed twin-fluid on the polishing pad. Accordingly, cleaning liquid is pressurized so as to be rapidly injected on a polishing pad so that slurry particles and alien substances on the polishing pad are completely removed. Furthermore, wafer scratch can be prevented and the life of the polishing pad can also be increased.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.