Method for fabrication of a conductive bump structure of a circuit board
US7674362B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 2, 2008 |
| Grant date | Mar 9, 2010 |
| Priority date | — |
| Expiry date | Jun 10, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0577
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a conductive bump structure of a circuit board is disclosed. The circuit board with a plurality of electrical connection pads is provided. An insulating protective layer and a resist layer are successively applied on the circuit board, wherein openings are formed in the layers at positions corresponding to the pads to expose the pads. Then, a conductive layer is formed on surfaces of the resist layer and openings, and a metal layer is formed on the conductive layer via electroplating and filled in the openings. Subsequently, the metal layer and conductive layer formed on the resist layer are removed via thinning, so as to form metal bumps on the pads. After the resist layer is removed, the metal bumps are covered by an adhesive layer to form a conductive bump structure for electrically connecting the circuit board to the external electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.