Die positioning for packaged integrated circuits
US7674656B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2006 |
| Grant date | Mar 9, 2010 |
| Priority date | — |
| Expiry date | Apr 26, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method that locates a plurality of die for forming a plurality of packaged integrated circuits. A frame is placed over the support structure, wherein the frame includes a plurality of openings therein and each opening of the plurality of openings has at least two walls. Each die of a plurality of die is placed over the support structure, wherein each die has at least two adjacent edges. The relative placing of the frame and the die results in each die being in an opening of the plurality of openings. Encapsulant is applied to the plurality of die. Either or both of the plurality of die and frame are moved in relation to the other in a manner that causes the two adjacent edges of each die of the plurality of die to substantially abut to and align with the two walls of an opening of the plurality of openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.