Treatment solution and method of applying a passivating layer
US7674725B2 · kind B2 · utility
0Cited by
8References
19Claims
0Family size
Assignee
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Key dates
| Filing date | May 25, 2005 |
| Grant date | Mar 9, 2010 |
| Priority date | — |
| Expiry date | Jun 21, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A treatment solution for a semiconductor wafer comprising water, a passivating reagent and a surfactant. The treatment solution is either mixed with a cleaning fluid, a rinsing fluid or a drying vapor, and is used in a cleaning apparatus employing a Marangoni dryer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.