Wiring board and method for manufacturing the same
US7674989B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 9, 2006 |
| Grant date | Mar 9, 2010 |
| Priority date | — |
| Expiry date | Jul 11, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring board for mounting a semiconductor element or electronic component having a plurality of wiring layers, an insulating layer provided between these wiring layers, and a via which is provided to the insulating layer and which electrically connects the wiring layers. In this wiring board, the cross-sectional shape of the via in the plane parallel to the wiring layers is obtained by the partial overlapping of a plurality of similar shapes (circles). Stable operation can be obtained in a semiconductor element by minimizing obstacles to increased density, effectively increasing the cross-sectional area of the via, and preventing the wiring resistance from increasing by making the cross-sectional shape of the via into a shape obtained by the partial overlapping of a plurality of similar shapes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.