Methods and apparatus for providing a power signal to an area array package
US7675147B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2007 |
| Grant date | Mar 9, 2010 |
| Priority date | — |
| Expiry date | Dec 25, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An area array device has a grid array of primary electrical contacts coupled to a coupling surface of the device and configured to carry data signals between the area array package and a circuit board. The area array device also has an additional series of secondary electrical contacts coupled to the coupling surface of the device and configured to carry power signals between the area array package and the circuit board. The additional series of secondary electrical contacts provides a relatively large amount of power to the area array package while allowing a manufacturer to maintain the number of primary electrical contacts of the grid array configured to carrying data signals and therefore maintain the overall performance of the area array package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.