Removable wafer expander for die bonding equipment
US7675170B2 · kind B2 · utility
6Cited by
15References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 3, 2007 |
| Grant date | Mar 9, 2010 |
| Priority date | — |
| Expiry date | Aug 22, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68336
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A removable wafer expander for die bonding equipment for a singularized wafer supported by a flexible sticky substrate, the removable wafer expander provided with a first ring member to be coupled with a second ring member for remote expansion of the flexible sticky substrate therebetween before the mounting of the wafer expander onto the die bonding equipment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.