Kevin Formosa
11Patents
3h-index
14Co-inventors
53Inventor score
Filing activity: Aug 3, 2007 → Dec 12, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7675170B2 | Removable wafer expander for die bonding equipment | Electricity | 6 | Active |
| US8837754B2 | Microelectromechanical transducer and corresponding assembly process | Emerging Cross-Sectional Technologies | 5 | Active |
| US10225635B2 | Microelectromechanical microphone | Electricity | 4 | Active |
| US9253579B2 | Package for a MEMS sensor and manufacturing process thereof | Electricity | 2 | Active |
| US9257372B2 | Surface mount package for a semiconductor integrated device, related assembly and manufacturing process | Emerging Cross-Sectional Technologies | 1 | Active |
| US10329143B2 | Package with chambers for dies and manufacturing process thereof | Electricity | 1 | Active |
| US11352251B2 | Electronic device and corresponding manufacturing method | Electricity | 0 | Active |
| US12017910B2 | Method of manufacturing electronic devices and corresponding electronic device | Performing Operations; Transporting | 0 | Active |
| US9446943B2 | Wafer-level packaging of integrated devices, and manufacturing method thereof | Electricity | 0 | Active |
| US11524892B2 | Method of manufacturing electronic devices and corresponding electronic device | Performing Operations; Transporting | 0 | Active |
| US9390988B2 | Method for soldering a cap to a support layer | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.