Method of manufacturing a circuit board
US7676917B2 · kind B2 · utility
6Cited by
10References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2007 |
| Grant date | Mar 16, 2010 |
| Priority date | — |
| Expiry date | Mar 26, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/3065
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a circuit board which may include the steps of forming a circuit board with horizontal and vertical fiberglass fibers, rotating the circuit board, and cutting the circuit board so that the horizontal and vertical fiberglass fibers form a non-right angle with a cut line of the circuit board. The circuit board may have a plurality of conductive traces located thereon which pass by areas of higher fiberglass-to-resin material and lower fiberglass-to-resin material to assist in reducing differential to common mode conversion between signals in the plurality of conducive traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.