Method of manufacturing printed circuit board including embedded capacitors
US7676921B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2007 |
| Grant date | Mar 16, 2010 |
| Priority date | — |
| Expiry date | Jul 20, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board manufactured by the method of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.