CMP composition of boron surface-modified abrasive and nitro-substituted sulfonic acid and method of use
US7678702B2 · kind B2 · utility
1Cited by
9References
23Claims
0Family size
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Key dates
| Filing date | Aug 24, 2006 |
| Grant date | Mar 16, 2010 |
| Priority date | — |
| Expiry date | Aug 24, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition contains a boron surface-modified abrasive, a nitro-substituted sulfonic acid compound, a per-compound oxidizing agent, and water. The composition affords high removal rates for barrier layer materials in metal CMP processes. The composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., step 2 copper CMP processes).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.