Composition for removing photoresist, method of removing photoresist and method of manufacturing a semiconductor device using the same
US7678751B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2005 |
| Grant date | Mar 16, 2010 |
| Priority date | — |
| Expiry date | Jan 13, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Disclosed are a composition for removing photoresist, a method of removing photoresist and a method of manufacturing a semiconductor device using a composition. The composition may include a ketone compound and a first polar aprotic solvent. The composition may also include the ketone compound and a second polar aprotic solvent. Moreover, the composition may include the first polar aprotic solvent and a second polar aprotic solvent with or without the ketone compound. The first polar aprotic solvent has at least one of an ether compound and an ester compound, and the second polar aprotic solvent has at least one of a sulfur-containing compound and a nitrogen-containing compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.