Sealed surface acoustic wave element package
US7679153B2 · kind B2 · utility
6Cited by
8References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2005 |
| Grant date | Mar 16, 2010 |
| Priority date | — |
| Expiry date | Jul 30, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An electronic component includes: a semiconductor substrate having a first surface and a second surface opposing to the first surface; a trans-substrate conductive plug that penetrates the semiconductor substrate from the first surface to the second surface; an electronic element provided in the vicinity of the first surface of the semiconductor; and a sealing member that seals the electronic element between the sealing member and the first surface, wherein the electronic element is electrically connected to the trans-substrate conductive plug.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.